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This is usually done using flexo printer technology and is then cured and annealed in a furnace. Originally tetra ethyl ortho silicate (TEOS) was used for the coating because it forms SiO2 like film when baked at 5000°C. 0. New materials having lower cure temperature are also being used. Vacuum deposition of SiO2 can also be used to obtain uniform, clean and robust coatings but this suffers from low throughput and higher cost. Polyimide (PI) layers The polyimide layer is coated on the substrates using either spin coating or a printing technique.
Usually, fully automated in-line production equipment is used for the LCD manufacturing steps. Besides the fully integrated production lines, single machines are also used or integrated into smaller production clusters. The various steps in the LCD assembly are described in detail below. 1 Typical panel assembly steps $PNNPOFMFDUSPEF *50 #MBDLNBUSJY 1PMBSJTFS $PMPVSGJMUFS $PMPVSGJMUFS 4IPSU -JRVJEDSZTUBM 4FBM "MJHONFOUMBZFS 4QBDFS 5'5"SSBZ #POEJOH1"% 5'5 1PMBSJTFS 1JYFMFMFDUSPEF *50 Note: stage 2 is where the surface of the film is rubbed with a piece of cloth Source: Samsung Electronics TFT production The manufacturing process used to fabricate TFT arrays, particularly a-Si TFT arrays, is very similar to semiconductor fabrication processes.
Growth has been strongest in the mid-size wide category or 19–21in wide, with 22in Wide expected to hit the market soon. The demand for LCD monitors is expected to continue, despite seasonal slowdowns, with new larger and wider sizes and in emerging markets such as Latin America. A continuously increasing LCD display size has helped grow the average desktop monitor size and most manufacturers offer a variety of screen widths and resolutions. The ramp-up from 4th generation to 5th and now 6th generation facilities has enabled this growth as well as the ability of manufacturers to offer a wide range of monitor sizes.
Developments in LCD's by Pira International Ltd